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|Title:||Modelling of microwave curing process for flip chip underfill materials||Authors:||Liu, Lie.||Keywords:||DRNTU::Engineering::Manufacturing||Issue Date:||2003||Abstract:||Smaller-faster-cheaper electronic devices have driven the packaging industry. Now the packaging technology thrusts the industry into chip-sale abnd chip-size packaging. The ultimate destination appears to be package-less components such as the flip chip.||URI:||http://hdl.handle.net/10356/6054||Rights:||Nanyang Technological University||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||MAE Theses|
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