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Title: Modelling of microwave curing process for flip chip underfill materials
Authors: Liu, Lie.
Keywords: DRNTU::Engineering::Manufacturing
Issue Date: 2003
Abstract: Smaller-faster-cheaper electronic devices have driven the packaging industry. Now the packaging technology thrusts the industry into chip-sale abnd chip-size packaging. The ultimate destination appears to be package-less components such as the flip chip.
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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