Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/60553
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dc.contributor.authorMehul Mukund Vora
dc.date.accessioned2014-05-28T06:16:10Z
dc.date.available2014-05-28T06:16:10Z
dc.date.copyright2001en_US
dc.date.issued2001
dc.identifier.urihttp://hdl.handle.net/10356/60553
dc.description.abstractBulge test has been used to test elastic properties of metal and ceramic films, but has proved inadequate to the task of testing viscoelastic properties for materials like polymers. A novel bulge test setup has been designed to overcome this drawback. The capability of the new setup to test at elevated temperatures and in controlled environments increases the scope of bulge test to a wide range of tests and materials. PMDA-ODA polyimide is used as the material to be characterized using the new bulge test setup designed as part of the dissertation. The material is also tested with alternative testing methods (TGA, TMA, wafer curvature and microtensile). The results from the alternate methods are used in conjunction to confirm the findings of bulge test as well as to prove its validity as a viscoelastic characterization tool. The polyimide material is characterized for it Tg, degradation temperature, coefficient of thermal expansion, residual stress, modulus and creep behavior.en_US
dc.format.extent182 p.en_US
dc.language.isoenen_US
dc.subjectDRNTU::Engineering::Materialsen_US
dc.titleThermo-mechanical characterization of polyimide thin film using bulge testen_US
dc.typeThesis
dc.contributor.schoolSchool of Materials Science & Engineeringen_US
dc.description.degreeMaster of Engineering (MAE)en_US
dc.contributor.researchSingapore-MIT Alliance Programmeen_US
dc.contributor.supervisor2Yi Sungen_US
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