Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/60586
Title: Thermal bonding and surface modification in the fabrication of COC polymer based microfluidic devices
Authors: Roy, Sunanda
Keywords: DRNTU::Engineering::Manufacturing
Issue Date: 2011
Abstract: Cyclic olefin copolymers (COC) are commonly used in the fabrication of microfluidic devices. Several issues need to be addressed before this can be realized. A fundamental understanding of the factors that affect thermal bond strength between different polymer substrates is necessary.This will enable the selection of suitable substrate pairs so that good thermal sealing between two polymeric substrates in microfluidic devices can be obtained. Furthermore, the intrinsically hydrophobic character of the COC surface has to be rendered hydrophilic to facilitate flow and electrophoretic separation.
URI: http://hdl.handle.net/10356/60586
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:SMA Theses

Files in This Item:
File Description SizeFormat 
Sunanda2011.pdf
  Restricted Access
Main Report3.75 MBAdobe PDFView/Open

Google ScholarTM

Check

Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.