Micro-machining of silicon and metals using femtosecond laser

Abstract

The objective of this project is to investigate the application of femtosecond lasers to micromachining. Specifically, the effects of the femtosecond laser on silicon and metals will be explored. Two specific applications will be considered in this investigation, they are the dicing of silicon wafers and manufacturing of metallic stents. The work done includes the optimization of the laser cutting process and an investigation of the key effects. A simulation of the laser cutting process on silicon was developed. The machining of a planer stent pattern using the femtosecond laser was also carried out.