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|Title:||Exploring & enhancing the possibilities of accelerated life testing of semiconductor components and transfer to mass production||Authors:||N. B. Vignesh
|Keywords:||DRNTU::Engineering::Manufacturing||Issue Date:||2004||Abstract:||This project focuses on the possibilities of enhancing the accelerated life testing of semiconductor interconnects. A reliable evaluation and measurement technique is developed, based on online monitoring of electrical parameters with high measuring resolution. Local monitoring of temperature and humidity with increased sampling rate provides a higher resolution and is far more effective in understanding the degradation mechanisms of semiconductor interconnects. Thus the new system provides a good predictive capability of the Mean Time to Failure (MTF) of adhesive interconnects. Also the present system isn't friendly enough for data handling and interpretation. Hence separate programs called - 'Real World & Deeper Analysis' have been developed for easy data handling and analysis.||URI:||http://hdl.handle.net/10356/60715||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||SMA Theses|
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