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https://hdl.handle.net/10356/6084
Title: | Development of polyurethane rubber- modified epoxy resin for microelectronics packaging | Authors: | Bhangale Sunil Madhukar. | Keywords: | DRNTU::Engineering::Materials::Electronic packaging materials | Issue Date: | 2000 | Abstract: | This project seeks to modify and characterise an epoxy-moulding compound using polyurethane-based rubber (stress modifier) for microelectronics packaging. The possibilities of incorporating polyurethane stress modifiers in a commercial moulding compound and their effects on its properties are explored. Two types of polyurethane (PU) namely, non-reactive PU and reactive PU are synthesised from a proprietary polyol, Polyol-A and an Isocyanate-A. The non-reactive PU stress modifier is a hydroxyl-terminated PU (OH-PU) while, the reactive PU stress modifiers are epoxide-terminated PU (Epo-PU) and PU-modified hardener (PUPH). Epo-PU and PUPH are synthesised via an intermediate, isocyanate-terminated PU (NCO-PU). PUPH-3070 and PUPH-4060, containing 30% and 40% by weight of NCO-PU respectively are synthesised. | URI: | http://hdl.handle.net/10356/6084 | Schools: | School of Mechanical and Production Engineering | Rights: | Nanyang Technological University | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
Appears in Collections: | MAE Theses |
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File | Description | Size | Format | |
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MAE-THESES_57.pdf Restricted Access | 17.96 MB | Adobe PDF | View/Open |
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