Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/6086
Title: Probe mark bondability study for B6HFC wafer technology - in relation to die pad damage and exposed oxide
Authors: Loh, Chee Ping.
Keywords: DRNTU::Engineering::Manufacturing
Issue Date: 2003
Abstract: This dissertation covers the experimental analysis of probe mark bondability fo BiCMOS wafer where the bond pads of size 100 micrometer by 100 micrometer were subjected to a matrix of touchdown and overdrive settings at ambient temperature during the wafer probing process.
URI: http://hdl.handle.net/10356/6086
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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