Please use this identifier to cite or link to this item:
https://hdl.handle.net/10356/6087| Title: | Analysis of heat dissipation and thermal enhancements in electronic packages | Authors: | Loh, Chiah Vern. | Keywords: | DRNTU::Engineering::Manufacturing | Issue Date: | 2001 | Abstract: | In this study, thermal characterization is carried out under natural and forced cooling conditions for four kinds of electronic packages. | URI: | http://hdl.handle.net/10356/6087 | Schools: | School of Mechanical and Production Engineering | Rights: | Nanyang Technological University | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
| Appears in Collections: | MAE Theses |
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| File | Description | Size | Format | |
|---|---|---|---|---|
| MAE-THESES_572.pdf Restricted Access | 5.44 MB | Adobe PDF | View/Open |
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