Please use this identifier to cite or link to this item:
Title: Thermal management of 3D integrated circuits with microchannel-based liquid cooling
Authors: Qian, Hanhua
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits
DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
Issue Date: 2014
Source: Qian, H. (2014). Thermal management of 3D integrated circuits with microchannel-based liquid cooling. Doctoral thesis, Nanyang Technological University, Singapore.
Abstract: The emerging three dimensional integrated circuit (3DIC) technology has offered promising solutions to problems faced by today’s 2D large-scale-integration (LSI) such as long propagation delay, high power consumption and limited I/O bandwidth. Unfortunately, the stacking nature of 3DICs exacerbates the existing thermal problems due to the simultaneous increase of power density and thermal resistance. This thesis studies the thermal management problem of 3DIC with microchannel-based liquid cooling. Specifically, a compact thermal model is developed in order to accurately simulate the steady state temperature of 3D systems with both heatsink and microfluidic cooling. A runtime proactive thermal management scheme, which adjusts flow rate according to predicted future cooling demand is proposed based on this thermal model. Thermal balancing through channel clustering, splitting and scaling techniques are also investigated and new algorithms are proposed for their implementation.
DOI: 10.32657/10356/61034
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

Files in This Item:
File Description SizeFormat 
Thesis_Qian Hanhua_G0802987A.pdfMain article3.98 MBAdobe PDFThumbnail

Page view(s)

Updated on Jan 29, 2023

Download(s) 5

Updated on Jan 29, 2023

Google ScholarTM




Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.