Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/6112
Title: Design-for-reliability methodology for lead-free solder joints
Authors: Low, Tse Hoong
Keywords: DRNTU::Engineering::Mechanical engineering::Mechanics and dynamics
Issue Date: 2005
Source: Low, T. H. (2005). Design-for-reliability methodology for lead-free solder joints. Master’s thesis, Nanyang Technological University, Singapore.
Abstract: In this project, a Design-For-Reliability (DFR) methodology was developed for solder joints. This methodology consists of three parts, (1) experimental methods for reliability test, (2) Finite Element Analysis (FEA): Modeling and Simulation and (3) Fatigue Life Prediction Analysis. This methodology aims to reduce the time taken to understand and improve the reliability and performance of electronic assemblies with lead-free solder joints.
URI: https://hdl.handle.net/10356/6112
DOI: 10.32657/10356/6112
Rights: Nanyang Technological University
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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