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https://hdl.handle.net/10356/6112| Title: | Design-for-reliability methodology for lead-free solder joints | Authors: | Low, Tse Hoong | Keywords: | DRNTU::Engineering::Mechanical engineering::Mechanics and dynamics | Issue Date: | 2005 | Source: | Low, T. H. (2005). Design-for-reliability methodology for lead-free solder joints. Master’s thesis, Nanyang Technological University, Singapore. | Abstract: | In this project, a Design-For-Reliability (DFR) methodology was developed for solder joints. This methodology consists of three parts, (1) experimental methods for reliability test, (2) Finite Element Analysis (FEA): Modeling and Simulation and (3) Fatigue Life Prediction Analysis. This methodology aims to reduce the time taken to understand and improve the reliability and performance of electronic assemblies with lead-free solder joints. | URI: | https://hdl.handle.net/10356/6112 | DOI: | 10.32657/10356/6112 | Schools: | School of Mechanical and Aerospace Engineering | Rights: | Nanyang Technological University | Fulltext Permission: | open | Fulltext Availability: | With Fulltext |
| Appears in Collections: | MAE Theses |
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| File | Description | Size | Format | |
|---|---|---|---|---|
| MAE-THESES_595.pdf | 15.87 MB | Adobe PDF |  View/Open |
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