Please use this identifier to cite or link to this item:
Title: Optimisation of the preclean II bell jar surface for reduction of defect density
Authors: Maung Phone Naing.
Keywords: DRNTU::Engineering::Manufacturing
Issue Date: 2004
Abstract: Most of the etched materials are adhered on the bell jar surface and some of them are pumped away by the Turbo pump. The bell jar is installed on top of the PCII chamber and the inner surface is under vacuum and the outer one is exposed to the atmosphere. The PCII process take place inside the chamber and it is under vacuum condition. The etched materials do not adheres well onto the bell jar surface due to the improper surface texture and instead fall onto the semiconductor wafer.
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

Files in This Item:
File Description SizeFormat 
  Restricted Access
11.13 MBAdobe PDFView/Open

Google ScholarTM


Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.