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Title: Operating curve management application for productivity improvement at wirebond
Authors: Ooi, Theng Hock.
Keywords: DRNTU::Engineering::Manufacturing::Production management
Issue Date: 2004
Abstract: Introduce the Operating Curve Management (OCM) concept and its application in the wirebonding process in the semiconductor environment, to allow the user to localize and optimize the available resources, to judge the potential of different improvement alternatives and to rate the results of the improvement actions.
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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