Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/6248
Title: Study of pool boiling enhancement structures and development of two phase cooling solution for electronics package
Authors: Oratti Kalandar Navas Khan
Keywords: DRNTU::Engineering::Mechanical engineering
Issue Date: 2006
Source: Oratti Kalandar Navas Khan. (2006). Study of pool boiling enhancement structures and development of two phase cooling solution for electronics package. Master’s thesis, Nanyang Technological University, Singapore.
Abstract: Advances in microelectronics design and manufacturing made possibe higher transistor density in a single device. IC chips are now being stacked vertically for better electrical performance and compact system design, which leads to high heat flux in the order of 50W/cm2. Air cooling has poor cooling efficiency for high power application, therefore liquid cooling /boiling heat transfer is preferred due its high heat removal capabilities. Pool boiling heat transfer is investigated for electonic cooling in this research with the target to achive 50W/cm2.
URI: https://hdl.handle.net/10356/6248
DOI: 10.32657/10356/6248
Rights: Nanyang Technological University
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

Files in This Item:
File Description SizeFormat 
MAE-THESES_717.pdf2.62 MBAdobe PDFThumbnail
View/Open

Page view(s) 50

305
Updated on May 8, 2021

Download(s) 20

137
Updated on May 8, 2021

Google ScholarTM

Check

Altmetric


Plumx

Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.