Study of pool boiling enhancement structures and development of two phase cooling solution for electronics package
Oratti Kalandar Navas Khan
Date of Issue2006
School of Mechanical and Aerospace Engineering
Advances in microelectronics design and manufacturing made possibe higher transistor density in a single device. IC chips are now being stacked vertically for better electrical performance and compact system design, which leads to high heat flux in the order of 50W/cm2. Air cooling has poor cooling efficiency for high power application, therefore liquid cooling /boiling heat transfer is preferred due its high heat removal capabilities. Pool boiling heat transfer is investigated for electonic cooling in this research with the target to achive 50W/cm2.
Nanyang Technological University