dc.contributor.authorOratti Kalandar Navas Khanen_US
dc.date.accessioned2008-09-17T11:10:15Z
dc.date.accessioned2017-07-23T08:39:00Z
dc.date.available2008-09-17T11:10:15Z
dc.date.available2017-07-23T08:39:00Z
dc.date.copyright2006en_US
dc.date.issued2006
dc.identifier.citationOratti Kalandar Navas Khan. (2006). Study of pool boiling enhancement structures and development of two phase cooling solution for electronics package. Master’s thesis, Nanyang Technological University, Singapore.
dc.identifier.urihttp://hdl.handle.net/10356/6248
dc.description.abstractAdvances in microelectronics design and manufacturing made possibe higher transistor density in a single device. IC chips are now being stacked vertically for better electrical performance and compact system design, which leads to high heat flux in the order of 50W/cm2. Air cooling has poor cooling efficiency for high power application, therefore liquid cooling /boiling heat transfer is preferred due its high heat removal capabilities. Pool boiling heat transfer is investigated for electonic cooling in this research with the target to achive 50W/cm2.en_US
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Mechanical engineering
dc.titleStudy of pool boiling enhancement structures and development of two phase cooling solution for electronics packageen_US
dc.typeThesisen_US
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.contributor.supervisorToh Kok Chuanen_US
dc.contributor.supervisorD. Pinjala
dc.description.degreeMASTER OF ENGINEERING (MPE)en_US


Files in this item

FilesSizeFormatView
MAE-THESES_717.pdf2.686Mbapplication/pdfView/Open

This item appears in the following Collection(s)

Show simple item record