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https://hdl.handle.net/10356/6271| Title: | Lead-free PCB assembly and effect of solder joint profile on the reliability of PCB assembly | Authors: | Periannan Arulvanan. | Keywords: | DRNTU::Engineering::Manufacturing::Production management | Issue Date: | 2004 | Abstract: | Lead-free Printed Circuit Board (PCB) assembly evaluation was undertaken to determine the effect of solder joint profile on the reliability of PCB assembly, by varying the foot print design on the PCB, solder paste deposition volume and solder reflow profile. PCBs were designed and fabricated with daisy chain loops connected to land pads of daisy chained Ball Grid Array (BGA) components with pad dimensions of 0.56 and 0.66mm NiAu finish. Material characterization and process validation was carried out. | URI: | http://hdl.handle.net/10356/6271 | Schools: | School of Mechanical and Production Engineering | Rights: | Nanyang Technological University | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
| Appears in Collections: | MAE Theses |
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| File | Description | Size | Format | |
|---|---|---|---|---|
| MAE-THESES_738.pdf Restricted Access | 12.77 MB | Adobe PDF | View/Open |
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