Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/63664
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dc.contributor.authorMuhammad Ridwan Mohd Idris
dc.date.accessioned2015-05-18T03:55:06Z
dc.date.available2015-05-18T03:55:06Z
dc.date.copyright2015en_US
dc.date.issued2015
dc.identifier.urihttp://hdl.handle.net/10356/63664
dc.description.abstractMicrofluidic devices have been around since the 1980s. They are used for researches in many different fields, ranging from engineering to biotechnology. As such, the demand for microfluidic devices is ever-growing. Many ways are then being explored to facilitate the fabrication of these devices in the shortest time possible. As a result, injection molding becomes the widely-chosen method to make these thermoplastic microfluidic devices due to its ability to rapidly produce parts in large quantities. One of the major concerns of microfluidic devices is the presence of molded-in residual stress. It has an effect on the microchannels deformation during the thermal bonding process. Therefore, the author will explore how the molding parameters affect the molded-in residual stress with the study focusing on holding temperature and cooling temperature of the injection molding process.en_US
dc.format.extent50 p.en_US
dc.language.isoenen_US
dc.rightsNanyang Technological University
dc.subjectDRNTU::Engineering::Mechanical engineeringen_US
dc.titleInjection molding of thermoplastics microfluidic deviceen_US
dc.typeFinal Year Project (FYP)en_US
dc.contributor.supervisorTor Shu Bengen_US
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.description.degreeBachelor of Engineering (Mechanical Engineering)en_US
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Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)
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FYP Final Report of Injection Molding of Thermoplastics Microfluidic Device2.25 MBAdobe PDFView/Open

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