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https://hdl.handle.net/10356/6408| Title: | Development of a 3D optical testing system for the study of IC packaging | Authors: | Su, Fei. | Keywords: | DRNTU::Engineering::Manufacturing | Issue Date: | 2004 | Abstract: | The main objective of this study is to develop an advanced 3-D optical testing system to measure the deformations of IC packages accurately and comprehensively. The present study consists of two parts: 1) development and construction of an advanced compact 3-D optical testing system; and 2) application of the 3-D optical testing system to IC packages for their hygro-thermo-mechanical reliability evaluation. | URI: | http://hdl.handle.net/10356/6408 | Schools: | School of Mechanical and Production Engineering | Rights: | Nanyang Technological University | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
| Appears in Collections: | MAE Theses |
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| File | Description | Size | Format | |
|---|---|---|---|---|
| MAE-THESES_861.pdf Restricted Access | 19.26 MB | Adobe PDF | View/Open |
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