Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/6408
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dc.contributor.authorSu, Fei.en_US
dc.date.accessioned2008-09-17T11:14:13Z-
dc.date.available2008-09-17T11:14:13Z-
dc.date.copyright2004en_US
dc.date.issued2004-
dc.identifier.urihttp://hdl.handle.net/10356/6408-
dc.description.abstractThe main objective of this study is to develop an advanced 3-D optical testing system to measure the deformations of IC packages accurately and comprehensively. The present study consists of two parts: 1) development and construction of an advanced compact 3-D optical testing system; and 2) application of the 3-D optical testing system to IC packages for their hygro-thermo-mechanical reliability evaluation.en_US
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Manufacturing-
dc.titleDevelopment of a 3D optical testing system for the study of IC packagingen_US
dc.typeThesisen_US
dc.contributor.supervisorChian, Kerm Sinen_US
dc.contributor.schoolSchool of Mechanical and Production Engineeringen_US
dc.description.degreeDoctor of Philosophy (MPE)en_US
item.grantfulltextrestricted-
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