Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/6436
Title: Improved edge uniformity in chemical & mechanical polishing of wafer by means of guide ring pressure using springs
Authors: Tan, Chek Soon.
Keywords: DRNTU::Engineering::Manufacturing
Issue Date: 2003
Abstract: In this project, a new carrier has been proposed via using simple springs to provide the pressurized guide-ring to improve the overall uniformity at a very much affordable cost. The first prototype uses polyphenylene sulfide (PPS) as the material for the rotating carrier. The second prototype uses ceramics as the carrier's material.
URI: http://hdl.handle.net/10356/6436
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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