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https://hdl.handle.net/10356/6436
Title: | Improved edge uniformity in chemical & mechanical polishing of wafer by means of guide ring pressure using springs | Authors: | Tan, Chek Soon. | Keywords: | DRNTU::Engineering::Manufacturing | Issue Date: | 2003 | Abstract: | In this project, a new carrier has been proposed via using simple springs to provide the pressurized guide-ring to improve the overall uniformity at a very much affordable cost. The first prototype uses polyphenylene sulfide (PPS) as the material for the rotating carrier. The second prototype uses ceramics as the carrier's material. | URI: | http://hdl.handle.net/10356/6436 | Schools: | School of Mechanical and Production Engineering | Rights: | Nanyang Technological University | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
Appears in Collections: | MAE Theses |
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File | Description | Size | Format | |
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MAE-THESES_887.pdf Restricted Access | 12.36 MB | Adobe PDF | View/Open |
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