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|Title:||Improved edge uniformity in chemical & mechanical polishing of wafer by means of guide ring pressure using springs||Authors:||Tan, Chek Soon.||Keywords:||DRNTU::Engineering::Manufacturing||Issue Date:||2003||Abstract:||In this project, a new carrier has been proposed via using simple springs to provide the pressurized guide-ring to improve the overall uniformity at a very much affordable cost. The first prototype uses polyphenylene sulfide (PPS) as the material for the rotating carrier. The second prototype uses ceramics as the carrier's material.||URI:||http://hdl.handle.net/10356/6436||Rights:||Nanyang Technological University||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||MAE Theses|
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