Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/6450
Title: Development of high strength gold bonding wires for fine pitch wire bonding process
Authors: Dong, Albert Renjun
Keywords: DRNTU::Engineering::Manufacturing
Issue Date: 2000
Abstract: This project focused on the development of new gold bonding wires, which has high modulus and break load. Various combinations of alloying elements were used to dope the pure gold forming different alloys. The mechanical properties including break load at certain elongation level and elastic modulus were used to determine the effectiveness of alloy strengthening element. It was found that Beryllium, and Calcium have most strengthening effect at low concentration level while Platinum and Copper have very good strengthening effect at high concentration level.
URI: http://hdl.handle.net/10356/6450
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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