Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/6465
Title: Optimization and application of Epon SU-8, an ultra-thick negative photoresist
Authors: Tan, Khee Lip.
Keywords: DRNTU::Engineering::Manufacturing
Issue Date: 2000
Abstract: Another application that requires ultra-thick photoresist films is micromachining in MEMS. Extremely large structure heights are frequently required for micro-electrodeposition of mechanical components such as coils, cantilevers and valves. These applications may require photoresist in excess of a hundred microns in thickness. The patterning of high aspect ratio structures in these ultra-thick photoresist films is extremely challenging. The aspect ratios easily exceed those encountered in submicron lithography for standard integrated circuit (IC) manufacturing. Unlike thin photoresist for IC manufacturing, lithography modelling and characterisation are not readily available for ultra-thick photoresist films.
URI: http://hdl.handle.net/10356/6465
Schools: School of Mechanical and Production Engineering 
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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