Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/6473
Title: Development of failure assessment methodology for lead-free electronic assembly
Authors: Che, Fa Xing.
Keywords: DRNTU::Engineering::Manufacturing
Issue Date: 2006
Source: Che, F. X. (2006). Development of failure assessment methodology for lead-free electronic assembly. Doctoral thesis, Nanyang Technological University, Singapore.
Abstract: In this study, reliability test and analysis methodology for lead-free (Pb-free) soldered assemblies subjected to thermal cycling, cyclic bend, drop impact and vibration loadings are investigated. Finite element analysis (FEA) is used as a numerical modeling tool for simulating solder micro-deformation and integrated with solder fatigue failure analysis assessment. In this project, a failure assessment methodology for modeling Pb-free (and Pb-based) soldered assemblies is proposed.
URI: http://hdl.handle.net/10356/6473
Rights: Nanyang Technological University
metadata.item.grantfulltext: restricted
metadata.item.fulltext: With Fulltext
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