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|Title:||Development of failure assessment methodology for lead-free electronic assembly||Authors:||Che, Fa Xing||Keywords:||DRNTU::Engineering::Manufacturing||Issue Date:||2006||Source:||Che, F. X. (2006). Development of failure assessment methodology for lead-free electronic assembly. Doctoral thesis, Nanyang Technological University, Singapore.||Abstract:||In this study, reliability test and analysis methodology for lead-free (Pb-free) soldered assemblies subjected to thermal cycling, cyclic bend, drop impact and vibration loadings are investigated. Finite element analysis (FEA) is used as a numerical modeling tool for simulating solder micro-deformation and integrated with solder fatigue failure analysis assessment. In this project, a failure assessment methodology for modeling Pb-free (and Pb-based) soldered assemblies is proposed.||URI:||https://hdl.handle.net/10356/6473||DOI:||10.32657/10356/6473||Rights:||Nanyang Technological University||Fulltext Permission:||open||Fulltext Availability:||With Fulltext|
|Appears in Collections:||MAE Theses|
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