Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/64824
Title: Micro-mechanics of interfacial debonding: demolding of hot-embossed polymeric microfluidic substrate
Authors: Jeffry William Tani
Keywords: DRNTU::Engineering::Manufacturing::Polymers and plastics
Issue Date: 2014
Source: Jeffry William Tani. (2014). Micro-mechanics of interfacial debonding: demolding of hot-embossed polymeric microfluidic substrate. Doctoral thesis, Nanyang Technological University, Singapore.
Abstract: Hot-embossing is one well-known micro-molding technique to fabricate the highly potential polymeric microfuidic devices. During the process, demolding which involves separation of polymer substrate from the mold is one crucial factor in determining the success of replication, because demolding defects are extremely prone to occur. This thesis aims to develop an in depth understanding in the demolding mechanics of the hot-embossed polymeric substrate based on analytica~experimental and numerical studies in order to facilitate successful and efficient mass production of the microtluidic devices. An understanding of the previously unknown main demolding-failure mechanism is also established. In addition, the influence of eight essential parameters on the demolding process and demolding failure has also been systematically studied. With the developed understanding of each parameter, it has been demonstrated that optimal processing conditions to achieve successful and efficient replications can be eventually accomplished. Moreover, the findings can also be readily utilized to provide optimal processing and design guidance for industrial application of polymer micro-molding as well as other novel replication processes.
URI: https://hdl.handle.net/10356/64824
DOI: 10.32657/10356/64824
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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