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Title: | Wire bond process development for low K (dielectric constant) materials | Authors: | Tan, Jonathan Yang Kern. | Keywords: | DRNTU::Engineering::Manufacturing | Issue Date: | 2004 | Abstract: | Describes results achieved in establishing a wire bonding process with different bonding wire types - 99% (2N) purity gold wire, 99.99% (4N) purity softer gold wire, 99.99% (4N) purity stiff gold wire. A relationship between the bulk material hardness of gold wire and the underpad failure mechanism will be established. | URI: | http://hdl.handle.net/10356/6500 | Schools: | School of Mechanical and Production Engineering | Rights: | Nanyang Technological University | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
Appears in Collections: | MAE Theses |
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MAE-THESES_944.pdf Restricted Access | 7.83 MB | Adobe PDF | View/Open |
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