Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/6501
Title: Polishing and planarization of polymeric materials for MEMS applications
Authors: Tan, Yew Heng.
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Microelectromechanical systems
Issue Date: 2005
Abstract: In this dissertation, the CMP process on polycarbonate and PMMA blanket substrates were investigated. Initially, four types of slurries were tested on these samples under the same CMP process condition. Slurry with the lowest surface roughness was then chosen and together with variation in process parameters. The experimental results show impacts of CMP process parameters on the removal rate and surface roughness of polycarbonate and PMMA substrate.
URI: http://hdl.handle.net/10356/6501
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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