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Title: Implementation of advanced manufacturing technology in a semi-conductor manufacturing company
Authors: Thangarajah Muralidharan.
Keywords: DRNTU::Engineering::Manufacturing
Issue Date: 2001
Abstract: The objectives are to transfer and implement wafer level packaging technology for a “xxx” semiconductor manufacturing company, implement computer integration for the new wafer level packaging manufacturing line and perform an assessment and to implement knowledge based system for addressing possible sources of defects.
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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