Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/65858
Title: Anti-heating transfer label
Authors: Koh, Randy Zhen Shun
Keywords: DRNTU::Engineering::Mechanical engineering
Issue Date: 2015
Abstract: The area of interest is to apply the concept of shape memory effect of EVA to confirm the feasibility of implementation as an alternative to existing anti-heating security label that is able to indicate to manufacturers if any tampering of their product by heat has taken place on the label in a noticeable manner, as well as the idea of replacing conventional substrate or a portion of a substrate for electrical circuits in RFID or NFC products with the ability to protect important components from excessive heat damage. Simple mechanical shrinkage and shape recovery techniques were used to determine the feasibility of application. Results obtained from heat shrink film showed that minimal duration and heat is required for mechanical shrinkage to occur. Visible signs of tear are noted within 10 seconds for spray paint and 20 seconds when coated with silver epoxy conductive adhesive. For EVA block, it is possible to cause a fracture due to strain by utilizing its shape recovery effect with the aid of a step at the programmed area causing the circuit to be disconnected. These findings support the concept of replacing existing substrate with reprogrammable material which requires further research and prototype fabrication.
URI: http://hdl.handle.net/10356/65858
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)

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