Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/65858
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dc.contributor.authorKoh, Randy Zhen Shun
dc.date.accessioned2015-12-31T02:24:36Z
dc.date.available2015-12-31T02:24:36Z
dc.date.copyright2015en_US
dc.date.issued2015
dc.identifier.urihttp://hdl.handle.net/10356/65858
dc.description.abstractThe area of interest is to apply the concept of shape memory effect of EVA to confirm the feasibility of implementation as an alternative to existing anti-heating security label that is able to indicate to manufacturers if any tampering of their product by heat has taken place on the label in a noticeable manner, as well as the idea of replacing conventional substrate or a portion of a substrate for electrical circuits in RFID or NFC products with the ability to protect important components from excessive heat damage. Simple mechanical shrinkage and shape recovery techniques were used to determine the feasibility of application. Results obtained from heat shrink film showed that minimal duration and heat is required for mechanical shrinkage to occur. Visible signs of tear are noted within 10 seconds for spray paint and 20 seconds when coated with silver epoxy conductive adhesive. For EVA block, it is possible to cause a fracture due to strain by utilizing its shape recovery effect with the aid of a step at the programmed area causing the circuit to be disconnected. These findings support the concept of replacing existing substrate with reprogrammable material which requires further research and prototype fabrication.en_US
dc.format.extent43 p.en_US
dc.language.isoenen_US
dc.rightsNanyang Technological University
dc.subjectDRNTU::Engineering::Mechanical engineeringen_US
dc.titleAnti-heating transfer labelen_US
dc.typeFinal Year Project (FYP)en_US
dc.contributor.supervisorHuang Weiminen_US
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.description.degreeBachelor of Engineering (Mechanical Engineering)en_US
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Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)
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