Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/67554
Title: Wireless position tag for uavonics
Authors: Lee, Clement Si Xiang
Keywords: DRNTU::Engineering
Issue Date: 2016
Abstract: In the world today, advancement in technology is very rapid. Wireless communications such as Global Positioning System (GPS) is one of the devices which have greatly advanced over the years. GPS is able to give moderately precise location to a location when in the outdoors. However, in the case of indoor localisation, there will be slight inaccuracy in determining the position of the device. For Unmanned Aerial Vehicle (UAV) indoor localisation, the precise location of a UAV is very crucial. Ultra-Wide Band (UWB) which is a relatively new device in the industry today have a large bandwidth lower power consumption and it’s suitable for indoor localisation. It is able to transmit frequency in the GHz range. It is able to send a short burst of signal to the receiver. Currently a tag is being tested which have a transceiver, CC1101 and a microcontroller, MSP430, which is currently about 10cm by 6cm. The objective of this project is to minimise the size and weight of the tag. A new microcontroller, CC1310 is used which have both the functions of the transceiver, CC1101 and microcontroller, MSP430. This greatly reduced the size of the PCB being fabricated. On top of that, the AA battery from the current tag was replaced with a 3V coin battery which is much smaller and lighter. The design of the new PCB is done in Altium Designer. There are various circuits to be placed together with the microcontroller, CC1310. Some of which are mainly the DC-DC Boost Converter, Nano System Power Timer and Voltage Doubler. It will be mounted together with the UWB transmitter for it to transmit to the receiver. Further developments for the CC1310 tag is to ensure that the tag is able to work in different conditions. Adding on to it the UWB transmitter board and the CC1310 tag can be incorporated together to fabricate a single PCB which will reduce the thickness as well as the size.
URI: http://hdl.handle.net/10356/67554
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Student Reports (FYP/IA/PA/PI)

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