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Title: Intrinsic stress in electroless nickel plating and its effect on reliability
Authors: Chen, Zhong.
Yip, Tick Hon.
Keywords: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
Issue Date: 2004
Abstract: Until today electroless nickel (EN) platers rely on their experience to control the quality of their products and the experience usually apply to individual's particular products only. Also the requirements from wide range of industries are so diverse that emphasis is often placed on very different aspects of the coating properties. Fundamental understanding of the intrinsic stress and its effect on coating behaviour are lacking. With the advancement of new technology in all sectors of the industry, it is expected that demand for high quality and high performance coating will also increase. This aims of this project is to: 1. Understand the intrinsic stress during electroless Ni-P plating 2. Study reliability matters with electroless Ni-P/lead-free solder reaction The results bear significance in improving the product quality and competitiveness. The result will facilitate further exploitation of the EN process into the new applications of more stringent quality requirements, for example, the semiconductor industry. This project also explores the application of electroless nickel plating to microelectronic industry, especially in the emerging EN flipchip bumping process.
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Research Reports (Staff & Graduate Students)

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