Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/6781
Title: Development of Pb-free solder for electronic assembly
Authors: Li, Guoyuan.
Keywords: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Issue Date: 2004
Abstract: This project aimed (1) to look for new lead-free solder alloy systems with improved properties for electronic packaging and assembly, (2) to study the effects of microstructural evolution on the reliability of the solder joints, and (3) to investigate the growth kinetics of the IMC formation in solder joints based on establishing new theoretical model.
URI: http://hdl.handle.net/10356/6781
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Research Reports (Staff & Graduate Students)

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