Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/6781
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dc.contributor.authorLi, Guoyuan.en_US
dc.date.accessioned2008-09-17T14:24:47Z-
dc.date.available2008-09-17T14:24:47Z-
dc.date.copyright2004en_US
dc.date.issued2004-
dc.identifier.urihttp://hdl.handle.net/10356/6781-
dc.description.abstractThis project aimed (1) to look for new lead-free solder alloy systems with improved properties for electronic packaging and assembly, (2) to study the effects of microstructural evolution on the reliability of the solder joints, and (3) to investigate the growth kinetics of the IMC formation in solder joints based on establishing new theoretical model.en_US
dc.format.extent102 p.-
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects-
dc.titleDevelopment of Pb-free solder for electronic assemblyen_US
dc.typeResearch Reporten_US
dc.contributor.schoolSchool of Materials Science & Engineeringen_US
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item.grantfulltextrestricted-
Appears in Collections:MSE Research Reports (Staff & Graduate Students)
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