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https://hdl.handle.net/10356/6781Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Li, Guoyuan. | en_US |
| dc.date.accessioned | 2008-09-17T14:24:47Z | - |
| dc.date.available | 2008-09-17T14:24:47Z | - |
| dc.date.copyright | 2004 | en_US |
| dc.date.issued | 2004 | - |
| dc.identifier.uri | http://hdl.handle.net/10356/6781 | - |
| dc.description.abstract | This project aimed (1) to look for new lead-free solder alloy systems with improved properties for electronic packaging and assembly, (2) to study the effects of microstructural evolution on the reliability of the solder joints, and (3) to investigate the growth kinetics of the IMC formation in solder joints based on establishing new theoretical model. | en_US |
| dc.format.extent | 102 p. | - |
| dc.rights | Nanyang Technological University | en_US |
| dc.subject | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects | - |
| dc.title | Development of Pb-free solder for electronic assembly | en_US |
| dc.type | Research Report | en_US |
| dc.contributor.school | School of Materials Science & Engineering | en_US |
| item.fulltext | With Fulltext | - |
| item.grantfulltext | restricted | - |
| Appears in Collections: | MSE Research Reports (Staff & Graduate Students) | |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| SME-RESEARCH-REPORT_22.pdf Restricted Access | 5.79 MB | Adobe PDF | View/Open |
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