Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/67881
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dc.contributor.authorLou, Jing Ting-
dc.date.accessioned2016-05-23T06:13:37Z-
dc.date.available2016-05-23T06:13:37Z-
dc.date.issued2016-
dc.identifier.urihttp://hdl.handle.net/10356/67881-
dc.description.abstractAs there are more and more virtual reality entertainment applications such as 3D movie and 3D Game. Immersive audio is more important in nowadays to enhance the entertainment experience. But most existing immersive audio technology is based on loudspeaker system such as Dolby surround. There are essential playback differences between loudspeaker and headphone. Different to natural sound listening or loudspeaker playback listening, headphone is attached to the ear drum closely. Thus sound arrivals two ear drum at almost the same time and cause the Interaural time difference information loss. Another effect is the absent of environment rendering, human body rendering and partial of pinna rendering. In additional, sound is rendering by the inner shape of the headphone. All these would lead to Interaural level difference information change. Thus, a stereo or multi-channel record playback with headphone would be lack of rendering by the environment and human being’s bio signature such as pinna and head. In this project, a binaural audio method called Head-Related Transfer Function is used to reproduce realistic 3-D sound. The final system satisfy both real-time processing and plug and play.en_US
dc.format.extent65 p.en_US
dc.language.isoenen_US
dc.rightsNanyang Technological University-
dc.subjectDRNTU::Engineering::Electrical and electronic engineering::Electronic systems::Signal processingen_US
dc.titleDevelopment of a real-time 3D audio headphoneen_US
dc.typeFinal Year Project (FYP)en_US
dc.contributor.supervisorGan Woon Sengen_US
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen_US
dc.description.degreeBachelor of Engineeringen_US
item.grantfulltextrestricted-
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Appears in Collections:EEE Student Reports (FYP/IA/PA/PI)
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