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dc.contributor.authorAung, Htu Co-
dc.description.abstractIn today’s world, power electronics play a vital role in revolutionary electronic gadgets and systems. Likewise, they are also crucial in developing next-generation hybrid and electric vehicles. In the process of developing power modules for those vehicles, important factors such as high efficiency, high power density, reliability and size are taken into great consideration. As the power converters get smaller, it becomes more difficult to embed sensors into the space constrained converters. One outstanding approach is to embed the sensors into a printed circuit board (PCB). This report is about the phase one of compact sensor system in a PCB for gate driver and control of a three phase power module. The sensor system includes a current sensor, based on the principle of a Rogowski coil, and an op-amp integrator circuit, which will act as a low pass filter, so that the device current of the embedded power semiconductor devices can be measured. Since the switched-mode currents will be measured, the dynamics of this current sensor are of vital importance.en_US
dc.format.extent62 p.en_US
dc.rightsNanyang Technological University-
dc.titleDevelopment of compact sensor system for gate driver and control of a three phase power moduleen_US
dc.typeFinal Year Project (FYP)en_US
dc.contributor.supervisorTseng King Jeten_US
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen_US
dc.description.degreeBachelor of Engineeringen_US
dc.contributor.researchRolls-Royce@NTU Corporate Laben_US
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Appears in Collections:EEE Student Reports (FYP/IA/PA/PI)
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