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Title: Report on industrial attachment with Micron Semiconductor Asia Pte Ltd
Authors: Lao, Luciana Lisa.
Keywords: DRNTU::Engineering::Materials
Issue Date: 2002
Abstract: This report emphazised on the two projects assigned to author during IA. The projects are Die Mount Evaluation of New Flip Chip Package and Materials Characterization and Evaluation on Adhesive Tapes.
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Student Reports (FYP/IA/PA/PI)

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