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Title: Report on industrial attachment with Hewlett-Packard (Singapore) Pte Ltd
Authors: Albertus, Denny Handoko
Keywords: DRNTU::Engineering::Materials
Issue Date: 2004
Abstract: This report focuses on, but not limited to, crack die e-test failure behavior of TIJ 2.X generation of HP print heads. The main interest of this project is to characterize the failures, especially, but not limited to, crack die. Means of electrical test and visual inspections are used extensively to identify individual failures.
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Student Reports (FYP/IA/PA/PI)

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