Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/6798
Title: Report on industrial attachment with Hewlett-Packard (Singapore) Pte Ltd
Authors: Albertus, Denny Handoko
Keywords: DRNTU::Engineering::Materials
Issue Date: 2004
Abstract: This report focuses on, but not limited to, crack die e-test failure behavior of TIJ 2.X generation of HP print heads. The main interest of this project is to characterize the failures, especially, but not limited to, crack die. Means of electrical test and visual inspections are used extensively to identify individual failures.
URI: http://hdl.handle.net/10356/6798
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Student Reports (FYP/IA/PA/PI)

Files in This Item:
File Description SizeFormat 
SME-REPORTS_5.pdf
  Restricted Access
2.51 MBAdobe PDFView/Open

Page view(s) 5

409
checked on Oct 24, 2020

Download(s) 5

10
checked on Oct 24, 2020

Google ScholarTM

Check

Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.