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https://hdl.handle.net/10356/6798| Title: | Report on industrial attachment with Hewlett-Packard (Singapore) Pte Ltd | Authors: | Albertus, Denny Handoko | Keywords: | DRNTU::Engineering::Materials | Issue Date: | 2004 | Abstract: | This report focuses on, but not limited to, crack die e-test failure behavior of TIJ 2.X generation of HP print heads. The main interest of this project is to characterize the failures, especially, but not limited to, crack die. Means of electrical test and visual inspections are used extensively to identify individual failures. | URI: | http://hdl.handle.net/10356/6798 | Schools: | School of Materials Science & Engineering | Rights: | Nanyang Technological University | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
| Appears in Collections: | MSE Student Reports (FYP/IA/PA/PI) |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| SME-REPORTS_5.pdf Restricted Access | 2.51 MB | Adobe PDF | View/Open |
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