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|Title:||Study of thermal conductivity for polycrystalline diamond||Authors:||Yang, Geer||Keywords:||DRNTU::Engineering||Issue Date:||2016||Abstract:||Thermal dissipating is very important in the semiconductor industry, because every semiconductor component has its own junction temperature, with current goes through the component, it will generates a lot of heat, if those heat cannot dissipate in time, the functions and life time of the semiconductor component will be heavily affected. In this project, synthetic diamond is chosen to be used as a heat dissipation material because according to the previous research results, diamond has a lot higher thermal conductivity (around 5 times) and lighter density than copper, which is usually being used in industrial heat dissipation. The synthetic diamond being used in this project is grown by MPCVD (Microwave Plasma Chemical Vapour Deposition) method. To test the thermal conductivity of this synthetic diamond, need to process by testing the TCR (temperature coefficient Resistance) of specimen diamond with probe station analysis, after that if test results meet requirement then proceed to IC packaging and wire bonding, final step is to use 3ω system measure and record data of specimen diamond and with the help of Origin 8 software data analysis to get thermal conductivity. In order to find out what parameters affect the thermal conductivity, studying Raman spectra and PL (Photoluminescence) of the diamond specimen would be considering helpful, again with the help of Origin 8 software, maybe will find out what is actually affecting the thermal conductivity of the synthetic diamond.||URI:||http://hdl.handle.net/10356/68034||Rights:||Nanyang Technological University||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||EEE Student Reports (FYP/IA/PA/PI)|
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