Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/6808
Title: Microscale cooling technology for electronic systems
Authors: Huang, Xiaoyang.
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Control and instrumentation
Issue Date: 2001
Abstract: This report documents the achievements of a strategic research project on 'Microscale cooling technology for electronics systems', JT MLC5/96. The project, funded jointly by the National Science and Technology Board (NSTB) and the Ministry of Education (MOE) of Singapore, is undertaken primarily by staff and researchers in the School of Mechanical and Production Engineering (MPE), Nanyang Technological University (NTU). Started in January 1997, the main objective of the project was to establish a research capability for heat transfer and fluid mechanics in micro or miniature scale devices, with particular emphasis on its application to high heat flux thermal management in the semiconductor and microelectronics packaging industries.
URI: http://hdl.handle.net/10356/6808
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Research Reports (Staff & Graduate Students)

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