Microscale cooling technology for electronic systems

Abstract

This report documents the achievements of a strategic research project on 'Microscale cooling technology for electronics systems', JT MLC5/96. The project, funded jointly by the National Science and Technology Board (NSTB) and the Ministry of Education (MOE) of Singapore, is undertaken primarily by staff and researchers in the School of Mechanical and Production Engineering (MPE), Nanyang Technological University (NTU). Started in January 1997, the main objective of the project was to establish a research capability for heat transfer and fluid mechanics in micro or miniature scale devices, with particular emphasis on its application to high heat flux thermal management in the semiconductor and microelectronics packaging industries.