Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/68498
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dc.contributor.authorChung, Jia Jye-
dc.date.accessioned2016-05-26T05:05:55Z-
dc.date.available2016-05-26T05:05:55Z-
dc.date.issued2016-
dc.identifier.urihttp://hdl.handle.net/10356/68498-
dc.description.abstractA109 aims to design and fabricate 3D profilometer, after making improvement such as shorter processing time and more accurate profile measurement. Existing profilometer that unable to carry out synchronizes among camera and projector and causes time delay on research studies, is now being integrated to enhance the overall efficiency of the 3D profilometer, and also the preparation system for 3D printing. 3D printing is a new trend of prototyping technology, and this additive manufacturing(AM) gradually replace conventional subtractive manufacturing or formative manufacturing. To obtain good surface quality and strong physical construction of a model, accurate data point of geometry incorporate with suitable Additive Manufacturing(AM) system are the keys to make it possible. High precision, fast processing time and automated noncontact surface profile and shape measurement device is hence extensively needed. In this report, description on how to use to integrate Digital Light Processing (DLP) fringe projector with camera with CMOS sensor to built up a profilometer, and work under the working principle of triangulation theory. With the combination of triangulation setup and structured light illumination, the 3D profilometer can measure fringe distortion to get the surface analysis. Clear surface analysis based on point cloud will be able to help system to carry out modeling for 3D printing. Software development on triggering CMOS camera and DLP fringe projector is also a challenge for this project.en_US
dc.format.extent78 p.en_US
dc.language.isoenen_US
dc.rightsNanyang Technological University-
dc.subjectDRNTU::Engineering::Mechanical engineering::Machine design and constructionen_US
dc.title3D profilometer for 3D printingen_US
dc.typeFinal Year Project (FYP)en_US
dc.contributor.supervisorAnand Krishna Asundien_US
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.description.degreeBachelor of Engineering (Mechanical Engineering)en_US
item.grantfulltextrestricted-
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Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)
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