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|Title:||Forced convection and sub-cooled flow boiling heat transfer from electronic chips||Authors:||Tou, Kwok Woon.
Tso, Chih Ping.
|Keywords:||DRNTU::Engineering::Materials::Microelectronics and semiconductor materials||Issue Date:||1999||Abstract:||Experiments are performed to study the single-phase forced convection heat transfer and subcooled flow boiling heat transfer from an in-line four simulated chips in a rectangular channel using water & FC-72.||URI:||http://hdl.handle.net/10356/6902||Rights:||Nanyang Technological University||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||MAE Research Reports (Staff & Graduate Students)|
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