Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/6902
Title: Forced convection and sub-cooled flow boiling heat transfer from electronic chips
Authors: Tou, Kwok Woon.
Tso, Chih Ping.
Keywords: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
Issue Date: 1999
Abstract: Experiments are performed to study the single-phase forced convection heat transfer and subcooled flow boiling heat transfer from an in-line four simulated chips in a rectangular channel using water & FC-72.
URI: http://hdl.handle.net/10356/6902
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Research Reports (Staff & Graduate Students)

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