Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/6947
Title: Research and development of advanced engineering mechanics technology for design and manufacturing of plastic encapsulated integrated circuits
Authors: Xiao, Zhongmin
Keywords: DRNTU::Engineering::Manufacturing::Polymers and plastics
Issue Date: 2003
Abstract: The purpose of this project is to characterize moisture-temperature-dependent mechanical behavior of molding compounds, and chemo-hygro-thermo-rheologically complex material behaviors of thermosetting molding compounds with various filler contents during the curing processes. Both finite element modeling and analytical investigation have been carried out to analyze the moisture absorption behavior of the encapsulant materials. The current report writing is based on the objectives proposed in the research proposal.
URI: http://hdl.handle.net/10356/6947
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Research Reports (Staff & Graduate Students)

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