Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/6947
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dc.contributor.authorXiao, Zhongminen_US
dc.date.accessioned2008-09-17T14:37:47Z
dc.date.available2008-09-17T14:37:47Z
dc.date.copyright2003en_US
dc.date.issued2003
dc.identifier.urihttp://hdl.handle.net/10356/6947
dc.description.abstractThe purpose of this project is to characterize moisture-temperature-dependent mechanical behavior of molding compounds, and chemo-hygro-thermo-rheologically complex material behaviors of thermosetting molding compounds with various filler contents during the curing processes. Both finite element modeling and analytical investigation have been carried out to analyze the moisture absorption behavior of the encapsulant materials. The current report writing is based on the objectives proposed in the research proposal.en_US
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Manufacturing::Polymers and plastics
dc.titleResearch and development of advanced engineering mechanics technology for design and manufacturing of plastic encapsulated integrated circuitsen_US
dc.typeResearch Reporten_US
dc.contributor.schoolSchool of Mechanical and Production Engineeringen_US
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Appears in Collections:MAE Research Reports (Staff & Graduate Students)
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