Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/6968
Title: Design-for-reliability methodology for evaluation of lead-free solder performance in electronic packaging assemblies
Authors: Pang, John Hock Lye
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Issue Date: 2004
Abstract: By 1st July 2006, legislations in the European Union (EU) will ban the use of lead (Pb) in all electronic products and this will effectively prohibit the use of tin-lead (Sn-Pb) solders and bring about a new paradigm shift in the technology and application of Lead-Free (Pb-free) electronic solders. Global consolidation in implementing Pb-free electronics manufacturing and reliable Pb-free electronic products has shifted the competitive edge of the industry to Pb-free readiness and competence. Solder technology is the key enabling technology for electrical interconnection in surface mounted integrated circuit (IC) components and printed circuit board (PCB) assemblies. A paradigm shift to Pb-free solders, soldering process, quality and reliability standards in electronic products, will have a major impact on Singapore's electronics manufacturing industry.
URI: http://hdl.handle.net/10356/6968
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Research Reports (Staff & Graduate Students)

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