Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/6987
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dc.contributor.authorNgoi, Bryan Kok Ann.en_US
dc.date.accessioned2008-09-17T14:38:59Z-
dc.date.available2008-09-17T14:38:59Z-
dc.date.copyright2000en_US
dc.date.issued2000-
dc.identifier.urihttp://hdl.handle.net/10356/6987-
dc.description.abstractThis project aims at gaining a better understanding of the mechanics of precision grinding of brittle materials. Indentation and scribing experiments on brittle materials were carried out to study crack initiation and propagation, brittle-ductile transition and material removal mechanism. The results of indentation and scribing tests show that brittle materials can be machined in a ductile manner when penetration depth is less than a critical value. Single point diamond turning of brittle materials, both as an alternative machining technique in its own right and as a model for certain parameters involved in grinding, was performed. Experimental results show that the properties of the workpiece material have a considerable influence on the critical depth of cut. Mirror surfaces are more prone to be generated on single crystal silicon than glasses. A smooth surface with a roughness in nano-scale was produced on silicon by properly controlling machining parameters. Tool wear mechanism in diamond cutting of glasses was investigated.en_US
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Mechanical engineering::Mechanics and dynamics-
dc.titleMechanics precision grinding brittle materialsen_US
dc.typeResearch Reporten_US
dc.contributor.schoolSchool of Mechanical and Production Engineeringen_US
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Appears in Collections:MAE Research Reports (Staff & Graduate Students)
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