Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/6992
Title: Dynamic characteristics of ultrasonic wire bonders
Authors: Guo, Ningqun.
Ling, Shih Fu.
Keywords: DRNTU::Engineering::Manufacturing::Product engineering
Issue Date: 2000
Abstract: This report describes the work undertaken under an applied research project that aims to study the dynamic characteristics of the wire bonder, and consists of two major parts, dynamic of ultrasonic transducer and modelling of bonding process
URI: http://hdl.handle.net/10356/6992
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Research Reports (Staff & Graduate Students)

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