Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/7014
Title: To investigate the mechanical/adhesion properties and mechanical reliability of thin films in electronics materials
Authors: Wan, Kai Tak
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
Issue Date: 2006
Abstract: Thin-layered structures of dissimilar materials have found increasing applications in many new advanced technologies. For instance, thin-layered structure is an essential feature in electronics packaging and microelectromechanical system (MEMS) device. In these devices, delamination due to crack propagation of the interface between dissimilar materials is a common failure mode and is strongly dependent on the adhesion strength of the interface.
URI: http://hdl.handle.net/10356/7014
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Research Reports (Staff & Graduate Students)

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