Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/7015
Title: Non-destructive analysis of microelectronic packages using computer x-ray tomography
Authors: Yeo, Benjamin Jin Soon.
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Issue Date: 2006
Abstract: Explores the capabities of using the 3D CT X-ray machine in evaluating multilayered stcked modules. Positioning of samples in machine was studied. Integrated images were used to compare with the micro cross section. Variation of various parameters such as voltage and current was done.
URI: http://hdl.handle.net/10356/7015
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Research Reports (Staff & Graduate Students)

Files in This Item:
File Description SizeFormat 
MAE-RESEARCH-REPORT-2_4.pdf
  Restricted Access
44.93 kBAdobe PDFView/Open

Google ScholarTM

Check

Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.