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|Title:||Non-destructive analysis of microelectronic packages using computer x-ray tomography||Authors:||Yeo, Benjamin Jin Soon.||Keywords:||DRNTU::Engineering::Electrical and electronic engineering::Microelectronics||Issue Date:||2006||Abstract:||Explores the capabities of using the 3D CT X-ray machine in evaluating multilayered stcked modules. Positioning of samples in machine was studied. Integrated images were used to compare with the micro cross section. Variation of various parameters such as voltage and current was done.||URI:||http://hdl.handle.net/10356/7015||Rights:||Nanyang Technological University||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||MAE Research Reports (Staff & Graduate Students)|
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