Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/7015
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dc.contributor.authorYeo, Benjamin Jin Soon.en_US
dc.date.accessioned2008-09-18T05:58:57Z-
dc.date.available2008-09-18T05:58:57Z-
dc.date.copyright2006en_US
dc.date.issued2006-
dc.identifier.urihttp://hdl.handle.net/10356/7015-
dc.description.abstractExplores the capabities of using the 3D CT X-ray machine in evaluating multilayered stcked modules. Positioning of samples in machine was studied. Integrated images were used to compare with the micro cross section. Variation of various parameters such as voltage and current was done.en_US
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Electrical and electronic engineering::Microelectronics-
dc.titleNon-destructive analysis of microelectronic packages using computer x-ray tomographyen_US
dc.typeResearch Reporten_US
dc.contributor.supervisorWong, Brian Stephenen_US
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
item.grantfulltextrestricted-
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Appears in Collections:MAE Research Reports (Staff & Graduate Students)
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