Please use this identifier to cite or link to this item:
Title: Mechanical and thermal characterization of flexible composite substrate
Authors: Low, Madeline Shin Yee
Keywords: DRNTU::Engineering::Materials::Composite materials
Issue Date: 2017
Abstract: Woven glass/epoxy composite substrate is broadly used in the electronic industries due to its high strength to weight ratio and improved lateral properties as compared to laminated composites. The mechanical reliability of the woven epoxy glass composite substrate plays a crucial role in electronic packaging quality. The focus of this research is to determine the limiting mechanical reliability that puts boundaries on application of composite substrate and further, the damage issues faced by the companies on smart cards modules made up of these substrates. With the daily usage of smart card, it faces different kind of physical and mechanical load, which will affect the functional purpose. Hence, by using various techniques to characterize the different composite substrate properties, the quality of product to serve its functionality is identified. The thermal properties of the substrates were also characterized using Thermogravimetric Analysis (TGA) and Dynamic Mechanical Analysis (DMA). Optical Microscope and Scanning Electron Microscope (SEM) were used to observe the damage after each mechanical testing. The results were analyzed and compared among different grades of substrates. The differences in resins and fiber volume fraction presented in the substrate give different mechanical behaviour. The substrate with a high fiber volume fraction shows complete failure during 2-point bending test. Moreover, the cladded copper layer on the substrate causes a decrease in tensile strength and an increase in bending load. Overall, the substrates with epoxy resin as matrix exhibit better thermal and mechanical properties.
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Student Reports (FYP/IA/PA/PI)

Files in This Item:
File Description SizeFormat 
FYP Report_Madeline_Final.pdf
  Restricted Access
1.98 MBAdobe PDFView/Open

Page view(s)

Updated on Jun 20, 2021

Download(s) 50

Updated on Jun 20, 2021

Google ScholarTM


Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.