Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/71391
Title: Experimental study of displacement and stress for tactile sensing : part 1
Authors: Seah, Wee Tat
Keywords: DRNTU::Engineering::Mechanical engineering
Issue Date: 2017
Abstract: Adhesion is a physical condition that leads to formation of a bonding scar tissue between the two or more organs. This will cause severe pain, obstruction and other fatal conditions. Due to similarity in symptoms with other illness like diverticulitis, endometriosis and appendicitis, it is harder to detect it. Moreover, if not detected early, it might result in to severe problems in the body of the individual that could cause monetary, mental, physical and life loss. Adhesions holds 15% to 20% for being the cause of secondary female infertility. [7] Adhesion causes organs that are normally separated to stick together which cases major problems like small bowel obstruction, chronic pelvic pain, dyspareunia infertility and more complications during subsequent surgery. Adhesion is a frequent source of medicolegal conflict. There are many different adhesions, such as pericardial adhesion, abdominal and pelvic adhesion, etc. [1]. The report will focus on pelvic and abdominal adhesion. In current state of art, methods such as laparoscopy and MRI scans are used to detect adhesion. However, such techniques are either invasive which might cause discomfort and pain for the patient or it is expensive and hard to afford for poor countries. Thus, the research is focusing on utilizing the change in skin elasticity and stresses on application of external pressure as a mechanical marker for diagnosis of adhesion. In the present study, an analogical test rig is developed to measure the deformation of the silicone skin (normal versus diseased) under application of external load.
URI: http://hdl.handle.net/10356/71391
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)

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